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International Patent: DICING SHEET FOR PLASMA DICING, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

GENEVA, Oct. 5 -- FURUKAWA ELECTRIC CO., LTD. filed a patent application (JP2026/011424) for “DICING SHEET FOR PLASMA DICING, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING SEMICOND... Read More


International Patent: DICING DIE-ATTACH FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

GENEVA, Oct. 5 -- FURUKAWA ELECTRIC CO., LTD. filed a patent application (JP2026/011425) for “DICING DIE-ATTACH FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/2... Read More


International Patent: RESIN PART AND INSERT MOLDED ARTICLE

GENEVA, Oct. 5 -- TEIJIN LIMITED filed a patent application (JP2026/011426) for “RESIN PART AND INSERT MOLDED ARTICLE”. With publication no. WO/2026/204911, here are the other details related to the p... Read More


International Patent: RESIN COMPOSITION, CURED PRODUCT, PREPREG, COPPER-CLAD LAMINATE, INTERLAYER INSULATING FILM, AND COMPOUND

GENEVA, Oct. 5 -- JSR CORPORATION filed a patent application (JP2026/011419) for “RESIN COMPOSITION, CURED PRODUCT, PREPREG, COPPER-CLAD LAMINATE, INTERLAYER INSULATING FILM, AND COMPOUND”. With publi... Read More


International Patent: ENERGY RAY-CURABLE FILM-SHAPED TRANSPARENT ADHESIVE, DEVICE OBTAINED BY BONDING CONSTITUENT MEMBERS USING SAME, AND METHOD FOR PRODUCING SAID DEVICE

GENEVA, Oct. 5 -- FURUKAWA ELECTRIC CO., LTD. filed a patent application (JP2026/011422) for “ENERGY RAY-CURABLE FILM-SHAPED TRANSPARENT ADHESIVE, DEVICE OBTAINED BY BONDING CONSTITUENT MEMBERS USING ... Read More


International Patent: ENERGY-RAY-CURABLE FILM-SHAPED TRANSPARENT ADHESIVE, DEVICE OBTAINED BY BONDING CONSTITUENT MEMBERS WITH SAME, AND METHOD FOR PRODUCING SAID DEVICE

GENEVA, Oct. 5 -- FURUKAWA ELECTRIC CO., LTD. filed a patent application (JP2026/011423) for “ENERGY-RAY-CURABLE FILM-SHAPED TRANSPARENT ADHESIVE, DEVICE OBTAINED BY BONDING CONSTITUENT MEMBERS WITH S... Read More


International Patent: CONDUCTIVE LAMINATE

GENEVA, Oct. 5 -- TATSUTA ELECTRIC WIRE & CABLE CO., LTD. filed a patent application (JP2026/011412) for “CONDUCTIVE LAMINATE”. With publication no. WO/2026/204901, here are the other details related ... Read More


International Patent: TEMPERATURE STRESS TOLERANCE IMPROVING AGENT FOR PLANT PROPAGULES

GENEVA, Oct. 5 -- KUREHA CORPORATION filed a patent application (JP2026/011413) for “TEMPERATURE STRESS TOLERANCE IMPROVING AGENT FOR PLANT PROPAGULES”. With publication no. WO/2026/204902, here are t... Read More


International Patent: RAG DATABASE CONSTRUCTION SYSTEM, CONSTRUCTION METHOD, AND CONSTRUCTION PROGRAM

GENEVA, Oct. 5 -- DENSO CORPORATION filed a patent application (JP2026/011418) for “RAG DATABASE CONSTRUCTION SYSTEM, CONSTRUCTION METHOD, AND CONSTRUCTION PROGRAM”. With publication no. WO/2026/20490... Read More


International Patent: LAMINATE, JOINED BODY, AND ELECTRIC/ELECTRONIC DEVICE

GENEVA, Oct. 5 -- NITTO DENKO CORPORATION filed a patent application (JP2026/011407) for “LAMINATE, JOINED BODY, AND ELECTRIC/ELECTRONIC DEVICE”. With publication no. WO/2026/204897, here are the othe... Read More